| 制造商 | Series | Packaging | Product Status | Type | Package Cooled | Attachment Method | Shape | Length | Width | Diameter | Fin Height | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material | Material Finish |
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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Packaging | Product Status | Type | Package Cooled | Attachment Method | Shape | Length | Width | Diameter | Fin Height | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material | Material Finish |
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HSE06-503045HEAT SINK, EXTRUSION, TO-218/TO- Same Sky (Formerly CUI Devices) |
0 | - |
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Datasheet |
HSE | Bag | Active | Board Level | TO-218, TO-220 | Clip | Rectangular, Fins | 1.969" (50.00mm) | 1.181" (30.00mm) | - | 1.772" (45.00mm) | 12.79W @ 75°C | 2.10°C/W @ 200 LFM | 5.86°C/W | Aluminum Alloy | Black Anodized |

